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Multi wafer processing

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  • Central Processing Unit — Die Artikel Prozessor (Hardware), Mikroprozessor und Hauptprozessor überschneiden sich thematisch. Hilf mit, die Artikel besser voneinander abzugrenzen oder zu vereinigen. Beteilige dich dazu an der Diskussion über diese Überschneidungen. Bitte… …   Deutsch Wikipedia

  • Central processing unit — Die Artikel Prozessor (Hardware), Mikroprozessor und Hauptprozessor überschneiden sich thematisch. Hilf mit, die Artikel besser voneinander abzugrenzen oder zu vereinigen. Beteilige dich dazu an der Diskussion über diese Überschneidungen. Bitte… …   Deutsch Wikipedia

  • Semiconductor device fabrication — Semiconductor manufacturing processes 10 µm 1971 3 µm 1975 1.5 µm 1982 …   Wikipedia

  • Direct bonding — describes a wafer bonding process without any additional intermediate layers. The bonding process is based on chemical bonds between two surfaces of any material possible meeting numerous requirements.[1] These requirements are specified for the… …   Wikipedia

  • Advanced Micro Devices — Infobox Company company name=Advanced Micro Devices, Inc. company logo= company type=Public (nyse|AMD) foundation=1969 founder=W. Jerry Sanders III Edwin J. Turney Additional co founders location city=Sunnyvale, California, US key people=Derrick… …   Wikipedia

  • Athlon 64 X2 — The Athlon 64 X2 is the first dual core desktop CPU manufactured by AMD. It is essentially a processor consisting of two Athlon 64 cores joined together on one die with additional control logic. The cores share one dual channel memory controller …   Wikipedia

  • Integrated circuit — Silicon chip redirects here. For the electronics magazine, see Silicon Chip. Integrated circuit from an EPROM memory microchip showing the memory blocks, the supporting circuitry and the fine silver wires which connect the integrated circuit die… …   Wikipedia

  • Solar cell — A solar cell made from a monocrystalline silicon wafer …   Wikipedia

  • materials science — the study of the characteristics and uses of various materials, as glass, plastics, and metals. [1960 65] * * * Study of the properties of solid materials and how those properties are determined by the material s composition and structure, both… …   Universalium

  • Three-dimensional integrated circuit — In electronics, a three dimensional integrated circuit (3D IC, 3D IC, or 3 D IC) is a chip in which two or more layers of active electronic components are integrated both vertically and horizontally into a single circuit. The semiconductor… …   Wikipedia

  • Mathematics and Physical Sciences — ▪ 2003 Introduction Mathematics       Mathematics in 2002 was marked by two discoveries in number theory. The first may have practical implications; the second satisfied a 150 year old curiosity.       Computer scientist Manindra Agrawal of the… …   Universalium

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